BEIJING, January 24 (TMTPost) --Semiconductor equipment manufacturers including TSMC are accelerating expansion projects for making advanced packaging, such as CoWoS, and revising up their production capacity targets. The orders falling under the category of 'Super Hot Run' from clients like NVIDIA and AMD are reportedly on the rise. TSMC's monthly CoWoS production capacity is projected to reach 32,000 wafers by the end of 2024, and hit 44,000 wafers by the end of 2025. CoWoS is a high-density advanced packaging technology developed by TSMC for high-performance chips.