Intel's 18A Wafer Fabrication Process Fails to Pass Broadcom's Tests
TMTPOST — Intel's wafer fabrication business has encountered a setback as its 18A manufacturing process failed to meet Broadcom's testing standards. Sources indicate that Broadcom's executives and engineers, after reviewing the test results, concluded that Intel's 18A technology is not yet suitable for mass production. The status of the collaboration between the two companies remains unclear, and it is uncertain whether Broadcom will abandon potential production deals.
Intel, however, maintains that its 18A process is progressing as planned, with good yield and high production capacity. The company emphasized its commitment to starting mass production next year and noted that there is significant industry interest in the 18A technology. Intel refrained from commenting on specific customer relationships. Broadcom's spokesperson mentioned that the company is still evaluating the products and services offered by Intel’s foundry, with the assessment ongoing.
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