TSMC Aims to Double CoWoS Capacity by 2025
Asianfin--TSMC has swiftly initiated a construction plan after acquiring Innolux’s Southern Taiwan Science Park factory in mid-August. According to supply chain sources, the move comes in response to urgent customer demand. TSMC is simultaneously finalizing the plant's acquisition and placing "priority orders" with facility and equipment suppliers to expedite the process.
The goal is for the plant to contribute to TSMC’s advanced CoWoS (Chip-on-Wafer-on-Substrate) packaging capacity by the first half of 2025. The company is pushing to double its total CoWoS capacity by that time to meet growing demand for advanced semiconductor packaging solutions.
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