Asianfin -- Nvidia CEO Jensen Huang has requested SK Hynix to accelerate the delivery of its next-generation high-bandwidth memory (HBM) chips, known as HBM4, by six months, according to SK Group Chairman Chey Tae-won. SK Hynix, which previously announced plans to start shipping HBM4 chips in the second half of 2025, confirmed on Monday that this updated timeline is faster than initially projected. Huang's push for earlier delivery underscores Nvidia’s anticipation of high demand for its upcoming AI-focused GPUs, which will incorporate HBM4 technology. Nvidia currently holds over 80% of the AI chip market, and HBM chips are essential for handling the immense data processing demands of AI systems. SK Hynix remains at the forefront of meeting global demand for HBM chips, crucial to Nvidia's graphics processing units. However, competition is intensifying, as rivals Samsung Electronics and Micron are racing to capture more of the HBM market. Samsung recently revealed progress on a potential supply deal for its 8-layer HBM3E chips, though the project had previously faced delays.