Asianfin --  Taiwan Semiconductor Manufacturing Company (TSMC) is contemplating price increases for its 3nm manufacturing process and CoWoS (Chip on Wafer on Substrate) advanced packaging technology in response to surging market demand, according to a recent report from Morgan Stanley. The price adjustments are expected to take effect in 2025, with an anticipated increase of up to 5% for the 3nm process and a potential rise of 10% to 20% for CoWoS packaging.