TMTPOST – Taiwan Semiconductor Manufacturing Company (TSMC) has dismissed rumors of order cuts for its CoWoS (Chip-on-Wafer-on-Substrate) packaging technology and assured investors of its ongoing expansion efforts to meet growing demand. During TSMC's recent earnings call, an investor inquired about reports suggesting order reductions for CoWoS, which could potentially slow expansion plans. TSMC Chairman Mark Liu categorically denied the claims, calling them "rumors," and reiterated the company’s commitment to scaling up production to satisfy customer needs. Industry insiders also affirmed that demand for TSMC's CoWoS technology remains robust. They clarified that even if some clients transition from CoWoS-S to CoWoS-L, this does not signify a reduction in orders. In fact, the overall production capacity of CoWoS-L remains insufficient to meet the rapidly growing demand from an expanding client base.