Nvidia Secures Over 70% of TSMC's Advanced Packaging Capacity for 2025
TMTPOST -- Nvidia has secured more than 70% of TSMC's advanced CoWoS-L packaging capacity for 2025 due to strong demand for its latest Blackwell architecture GPU chips.
The shipment volume is expected to grow by over 20% quarter-over-quarter as production ramps up throughout the year.
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