TMTPOST -- Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest contract chipmaker, announced plans to open a new chip design centre in Munich, Germany, company executives said Tuesday. Paul de Bot, President of TSMC Europe, shared at the company’s 2025 Technology Symposium that the Munich Design Centre is scheduled to launch in the third quarter of 2025. The centre aims to support European customers in developing high-density, high-performance, and energy-efficient chips, with a particular focus on applications in automotive, industrial sectors, artificial intelligence (AI), and the Internet of Things (IoT), de Bot said. This expansion complements TSMC’s ongoing collaboration with Infineon, NXP, and Robert Bosch to establish the European Semiconductor Manufacturing Company (ESMC), a new microchip fabrication plant currently under construction in Dresden, Germany.